Fused silica JGS2 wafer 4 inch 500 um DSP
Fused Silica wafer 500 µm
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€0.00
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€30.00
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Product number:
WUS40500250X0000SNN5
Description
Product information "Fused silica JGS2 wafer 4 inch 500 um DSP"
Fused silica JGS2 wafer 4 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, laser-marking: LAAS 2024 FS XXX (XXX = consecutive number)