Fused silica wafer 2 inch 700 um DSP
Fused Silica wafer 700 µm
| Quantity | Unit price |
|---|---|
| To 49 |
€8.00
|
| To 99 |
€7.50
|
| To 199 |
€7.10
|
| To 299 |
€6.80
|
| To 399 |
€6.60
|
| To 599 |
€6.20
|
| To 999 |
€5.80
|
| From 1000 |
€5.40
|
No longer available - availability check on request
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Stock:
0
Product number:
WUS20700250X0000XNN1
Description
Product information "Fused silica wafer 2 inch 700 um DSP"
Fused silica JGS2 wafer 2 inch, thickness = 700 ± 25 µm, 2-side polished, TTV < 10 µm, top side Ra < 1 nm, S/D < 40/20, C shape CNC edge grounding, NO FLAT