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Quartz wafer 4 inch 500 um ST-Cut DSP

Quartz wafer 500 µm ST-Cut

Product information "Quartz wafer 4 inch 500 um ST-Cut DSP"

Quartz wafer 4 inch, thickness = 500 ± 25 µm, ST-Cut, 2-side polished, TTV < 10 µm, warp < 30 µm, primary flat 32.5 mm

Diameter (round): 4 inch
Material: Quartz
Orientation: ST-Cut
Surface: 2-side polished
Thickness: 401 - 500 µm