NB SEMIPLATE AU 100 TL
Our Gold Plating Solution without arsenic
! PRODUCT NAME CHANGE !
Old Name: NB Semiplate AU 100 TH
New Name: NB Semiplate AU 100 TL
General Information
NB SEMIPLATE AU 100 TL is an alkaline, non-cyanide electroplating formulation which produces a matte to semi-bright, ductile deposit. While the NB SEMIPLATE AU 100 product contains arsenic for achieving shiny deposits, the NB SEMIPLATE AU 100 TL is based on thallium and free of arsenic. In comparison with other gold plating processes, the NB SEMIPLATE AU 100 TL electrolyte demonstrates exceptional throwing power that results in good coverage of recesses, holes and hollows of parts of complex geometry.
NB SEMIPLATE AU 100 TL deposits have main applications in MEMS processing.
Product | Brightening agent | Surface / grain |
---|---|---|
NB SEMIPLATE AU 100 TL | thallium | matt to semi-bright / coarse |
NB SEMIPLATE AU 100 | arsenic | shiny / fine |
NB SEMIPLATE AU 100 TL has the following characteristics:
- very stable bath, sulfite based
- very uniform thickness
- shiny surface, grain refiner free of arsenite
- low temperature plating
NB SEMIPLATE AU 100 TL is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
In comparison with other gold plating processes, the NB SEMIPLATE AU 100 TL electrolyte demonstrates exceptional throwing power that results in good coverage of recesses, holes and hollows of parts of complex geometry.
Deposits from the NB SEMIPLATE AU 100 TL process also exhibit the unique ability to build brightness with increasing thickness. Specific gravity measurements of the deposit consistently show values of 19.1 which indicate freedom of codeposited polymers generally found in deposits from other systems of similar purity. NB SEMIPLATE AU 100 TL deposits have main applications in MEMS processing.
Physical properties of the Au layer
- Physical Properties of the Deposit
- Purity 99.9% Hardness 130 to 190 mHV0,020
- Contact Resistance 0.3 mW (measured by cross-wire method with 200 gram load
- Deposit weight for 2.5 microns 31.6 mg/in 2 (4.9 mg/cm2) (100 micro inches)
Application Example
Electroplating projects realized with our electrolytes:
> MicroSwitch
> Wire Connection of Polyimide Foil
Technical Data Sheet:
For further information please refer to the technical data sheet:
> NB Semiplate Au 100 TL (TDS)
> Instruction NBT Sample Service for plating baths
Individual Technical Support and Price Request
Available Sales Units:
- 5 L bottles
Compatible :
- Purity Grades: VLSI/ ULSI or MEMS
- Photoresists: (AZ-)Resist compatible
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
e-mail: sales(at)microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908