NB SEMIPLATE CU 100
Our Copper Plating Solution
The NB SemiPlate Cu 100 processis an acid copper plating formulation engineered for wafer plating applications including copper bump plating, interconnects for VLSI/ ULSI or MEMS.
NB SemiPlate Cu 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
The NB SemiPlate Cu 100 process provides excellent throwing power, improved levelling characteristics, ductile low stress deposits and offers unique flexibility in its operation.
Electroplating projects realized with our electrolytes:
> Wire Connection of Polyimide Foil
Technical Data Sheet:
For further information please refer to the technical data sheet:
Individual Technical Support and Price Request
Available Sales Units:
- 1 L and 5 L bottles
- Purity Grades: VLSI/ ULSI or MEMS
- Photoresists: (AZ-)Resist compatible
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908