NB SEMIPLATE NI 100
Our Nickel Plating Solution
NB SEMIPLATE NI 100 is a nickelsulfamate electroplating process that produces a pure, ductile, finegrained,semi-bright low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.
NB SEMIPLATE NI 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
NB SEMIPLATE NI 100 is manufactured to meet the requirements associated with the electroforming of microstructured wafers (Micro System Technology).
The NB SEMIPLATE NI 100 process contains an anode activating agent in controlled amounts to enhance anode corrosion and prevent anode passivation.
Deposit properties are easy to control and maintain.
Feature / Benefits
- Pure nickel depositions
- High ductile plating
- Fine grained, satin dull deposition
- Controllable inner stress of the deposition up to 7000 µm
- No anode passivation
- High hardness, controllable
- Good throwing power
Technical Data Sheet:
For further information please refer to the technical data sheet:
> NB Semiplate Ni 100 (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes
Individual Technical Support and Price Request
Available Sales Units:
- 1 L and 5 L bottles
- Purity Grades: VLSI/ ULSI or MEMS
- Photoresists: (AZ-)Resist compatible
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908