Nickel-Manganese Plating Solution

General Information

NB Semiplate NiMn 100 is a nickelsulfamate electroplating process, which incorporates small amounts of Mn in the deposit. While properties of pure Ni deposits change dramatically during temperature treatments, the Mn content stabilises the hardness, ductility and yield strength under temperature treatments as high as 600°C. Secondly, such properties do not dramatically change in operation. Therefore, the process is well suited for Ni films used for micro-electromechanical functions, as required for sensors and actuators in microsystem technology.

The process can be operated:

  • for rather columnar growth without grain refiner and rather rough surface condition; this is the ready-to-use product status of NB Semiplate NiMn 100
  • or for fine-grained films and semi-rough surface using the grain refiner Ni 100 ADD. AGENT


  • High purity nickel depositions
  • High stability of mechanical properties under temperature and in operation
  • High ductility
  • High hardness
  • Fine grained or large grained
  • Medium mechanical stress impact of Mn incorporation (depending on operation condition)
  • No anode passivation
  • Good throwing power

Technical Data Sheet:

For further information please refer to the technical data sheet:
> NB Semiplate NiMn (TDS)

Individual Technical Support and Price Request

Available Sales Units:

  • 1 L and 5 L bottles

Compatible :

  • Purity Grades: VLSI/ ULSI or MEMS
  • Photoresists: (AZ-)Resist compatible

If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908

Thank you for your interest!

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