Remover / Stripper

Positive Photoresist Removal

Acetone

Acetone is not well-suited as stripper for photoresists: The high vapour pressure of acetone causes a fast drying and thus re-deposition of stripped photoresist onto the substrate forming striations. If nevertheless acetone shall be used for this purpose, a subsequent rinse with isopropyl alcohol - immediately after the acetone step - is recommended in order to remove the resist-contaminated acetone residual-free.

For further information please refer to the product page:
> Actone

NMP

NMP (1-Methyl-2-pyrrolidon) is a powerful stripper due to its physical properties: NMP yields a low vapour pressure (no striation formation), strongly solves organic impurities as well as resists, keeps the removed resist in solution, and can be heated to 80°C due to its high boiling point. However, since NMP is classified as toxic and teratogenic, a recommended alternative is.

For further information please refer to the product page:
> NMP

DMSO

DMSO (Dimethyl sulfoxide) has a performance as photoresist stripper comparable to the performance of NMP, and is a kind of “safer-solvent” substitute for NMP.

For further information please refer to the product page:
> DMSO

TechniStrip Micro D350

TechniStrip Micro D350 has a performance as dmso-based photoresist stripper comparable to the performance of NMP, and is a kind of “safer-solvent” substitute for NMP.

For further information please refer to the product page:
> TechniStrip Micro D350

AZ^_® 100 Remover

AZ^_® 100 Remover is an amine-solvent mixture, and a ready-to-use standard remover for AZ^_® and TI photoresists. In order to improve its performance, AZ^_® 100 Remover can be heated to 60-80°C. Since AZ^_® 100 Remover is strongly alkaline, aluminium containing substrates might be attacked as well as copper- or GaAs alloys/compounds. In this case, AZ^_® 100 Remover should be used as concentrate, any dilution or contamination of AZ^_® 100 Remover with water (even in traces!) has to be avoided.

For further information please refer to the product page:
> AZ^® 100 Remover

Crosslinked Positive Resist, Epoxy- or Acrylic-based Resin and Polyimide Remova

TechniStrip^_® P1316

TechniStrip^_® P1316 is a NMP-free, with almost all common substrate materials compatible powerful remover for

• Novolak-based positive resists such as all positive AZ^_® resists.
• Epoxy-based resists
• Polyimides, bonding glues
• Dry films

At 75°C, TechniStrip^_® P1316 is able to dissolve – not only peel – even heavily crosslinked resists (e. g. by dry etching or ion implantation) from the substrate in few minutes. TechniStrip^_® P1316 can be used in batch immersion and batch spray equipment, as well as in single wafers cleaning tools due to its high stripping efficiency.

For further information please refer to the product page:
> TechniStrip^_® P1316

Negative and Thick Resist Removal

TechniStrip^_® NI555

TechniStrip^_® NI555 is a NMP-free and with almost all common substrate materials compatible powerful remover for Novolak-based negative resists and ultrathick positive resists such as

• AZ^_® nLOF 2000
• AZ^_® 15 nXT
• AZ^_® 40 XT

TechniStrip^_® NI555 was developed to address fast and complete photoresist film dissolution thus avoiding filter clogging and subsequent insoluble resin debris deposition encountered with most of standard stripping solutions.

For further information please refer to the product page:
> TechniStrip^_® NI555