NB SEMIPLATE SN 100

Our Tin Plating Solution

General Informations

NB SEMIPLATE SN 100 is a highpurity electroplating process which produces fine-grained, matte, pure tin deposits. It is especially formulated for use in the fabrication of circuit patterns and bumps on semiconductor wafers.

NB SEMIPLATE SN 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).

The process contains no fluoborates or formaldehyde and can be used with either soluble or insoluble anodes.

Application Example

Electroplating projects realized with our electrolytes:
> MicroSwitch

> Wire Connection of Polyimide Foil

Technical Data Sheet:

For further information please refer to the technical data sheet:
> NB Semiplate Sn 100 (TDS)

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Individual Technical Support and Price Request

Available Sales Units:

  • 1 L and 5 L bottles

Compatible :

  • Purity Grades: VLSI/ ULSI or MEMS
  • Photoresists: (AZ-)Resist compatible

If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908

Thank you for your interest!

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