Our Tin Plating Solution NB SEMIPLATE SN 100
1 and 5 L units, short lead time, (AZ-)Resist compatible
NB SEMIPLATE SN 100 is a highpurity electroplating process which produces fine-grained, matte, pure tin deposits. It is especially formulated for use in the fabrication of circuit patterns and bumps on semiconductor wafers.
NB SEMIPLATE SN 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
The process contains no fluoborates or formaldehyde and can be used with either soluble or insoluble anodes.
For further informations please refer to TDS NB Semiplate Sn 100 en.pdf
Individual Technical Support and Price Request
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
Tel.: +49 (0)731 36080 409
Fax: +49 (0)731 36080 908