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Silicon, quartz, quartz glass and borosilicate glass wafers

The term photolithography refers to the structuring of metallic, ceramic, organic or semiconductor materials. In microelectronics, micro-mechanics or micro-optics, flat substrates made of silicon, quartz or glass are usually used for this purpose.

> Electroplating: Basics

> Electroplating of Au, Cu, Ni and Ag

Silicon wafers Quartz wafers Quartz glass wafers Borosilicate glass wafers coated wafers

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1 inch
2 inch
3 inch
4 inch
5 inch
6 inch
8 inch
12 inch

Arsen
Bor
p-type

Borosilicate
CZ-Si
FZ-Si
Fused Silica
Quartz
Si + Si3N4 (0 nm)
Si + Si3N4 (50 nm)
Si + Si3N4 (60 nm)
Si + Si3N4 (70 nm)
Si + Si3N4 (80 nm)
Si + Si3N4 (100 nm)
Si + Si3N4 (150 nm)
Si + Si3N4 (300 nm)
Si + Si3N4 (500 nm)
Si + SiO2 (dry) (20 nm)
Si + SiO2 (dry) (50 nm)
Si + SiO2 (dry) (90 nm)
Si + SiO2 (dry) (100 nm)
Si + SiO2 (dry) (200 nm)
Si + SiO2 (dry) (280 nm)
Si + SiO2 (dry) (290 nm)
Si + SiO2 (dry) (300 nm)
Si + SiO2 (wet) (0 nm)
Si + SiO2 (wet) (250 nm)
Si + SiO2 (wet) (300 nm)
Si + SiO2 (wet) (500 nm)
Si + SiO2 (wet) (1000 nm)
cz-si

100
110
111
ST-Cut
X-Cut
Y-Cut
Z-Cut

Dummy
Prime
Test

6 - 10 mm
11 - 20 mm
21 - 50 mm
51 - 100 mm

0 - 0.01 Ohm cm
0.01 - 0.1 Ohm cm
0.1 - 1 Ohm cm
1 - 10 Ohm cm
10 - 100 Ohm cm
100 - 1000 Ohm cm
1000 - 10000 Ohm cm
> 10000 Ohm cm

0 - 100 nm
101 - 200 nm
201 - 300 nm
401 - 500 nm
701 - 1000 nm

0 - 100 nm
100 - 200 nm
201 - 300 nm
401 - 500 nm
701 - 1000 nm
1001 - 2000 nm
> 2 µm

1-side polished
2-side polished

100 - 200 µm
201 - 300 µm
301 - 400 µm
401 - 500 µm
501 - 700 µm
701 - 1000 µm
1001 - 2000 µm
> 2 mm
> 2000 µm

Minimum €

–

Maximum €

Details

Borosilicate 1 inch 250 um DSP

WGS10250250XXXXXXNN1

Borosilicate glass 1 inch, thickness = 250 ± 25 µm, 2-side polished, TTV < 10 µm, packaging units of 100 wafers - no flat

Stock: 500

From €2.80*

Details

Borosilicate 2 inch 2000 um DSP

WGS22000250X0000SNN2

Borosilicate 2 inch, thickness = 2000 ± 25 µm, 2-side polished, TTV < 10 µm, no flat

Stock: 43

From €9.50*

Details

Borosilicate 20 x 20 mm 500 um DSP

W9GS0200200500NNNNX1

Borosilicate piece (20 x 20 mm), thickness = 500 ± 25 µm, 2-side polished

Stock: 780

From €2.00*

Details

Borosilicate 3 wafer inch 150 um SSP

WGV30150250X0000SNN1

Borosilicate 3 inch, thickness = 150 ± 25 µm, 1-side polished, primary flat 22 mm - only box with 50 pieces (cake Box) !

Stock: 250

From €12.50*

Details

Borosilicate 32 x 24 mm 200 um DSP

W9GS0320240200NNNNX1

Borosilicate piece (32 x 24 mm), toleranace +0.0 / -0.5 mm, thickness = 200 ± 25 µm, 2-side polished, units of 10 pieces

Stock: 68

From €6.80*

Details

Borosilicate 4 inch 175 um DSP

WGS40175200X0000SNN1

Borosilicate 4 inch, thickness = 175 ± 20 µm, 2-side polished, TTV < 10 µm

Stock: 145

From €21.50*

Details

Borosilicate 4 inch 2000 um DSP

WGS42000250X0000SNN1

Borosilicate glass 4 inch, thickness = 2000 ± 25 µm, 2-side polished, 1 Flat, units of 10 wafers

Stock: 70

From €21.00*

Details

Borosilicate 4 inch 500 um DSP

WGS40500250XXXXXSNN1

Borosilicate 4 inch, thickness = 500 ± 25 µm, 2-side polished, 1 SEMI flat

Stock: 401

From €13.00*

Details

Borosilicate 4 inch 900 um DSP

WGS40900300X0000SNN1

Borosilicate 4 inch, thickness = 900 ± 30 µm, 2-side polished, TTV < 10 µm, 1 Flat

Stock: 320

From €15.20*

Details

Borosilicate 5 x 5 mm 700 um DSP

W9GS0050050700NNNNX1

Borosilicate piece (5 x 5 mm), thickness = 700 ± 25 µm, 2-side polished, sales units of 60 pieces

Stock: 580

From €1.50*

Details

Borosilicate 6 inch 700 um DSP

WGS60700200X0000XNN1

Borosilicate Glas wafer 6 inch, thickness = 700 µm, 2-side polished, TTV < 10 µm, Bow/Warp < 40 µm, Ra < 1 nm, no Flat

Stock: 159

From €26.00*

Details

Borosilicate 6 inch 700 um SSP

WGV60700250X0000SNN2

Dummy Borosilicate 6 inch, thickness = 700 ± 25 µm, 1-side polished, not particle-specified (stock with 1x2 pcs, 1x15, 1x22, 3x25)

Stock: 62

From €13.00*

Details

Borosilicate 8 inch 1250 um DSP

WGS81250250X0000SNN2

Borosilicate 8 inch, thickness = 1250 ± 25 µm, 2-side polished, primary flat 57.7 mm

Stock: 40

From €58.00*

Details

Borosilicate Glas wafer 4 inch 700 um DSP

WGS40700200X0000SNN2

Borosilicate Glas wafer 4 inch, thickness = 700 µm, 2-side polished, 1 Semi Flat

Stock: 202

From €13.00*

Details

Borosilicate Glas wafer 4 inch 700 um SSP

WGV40700200X0000SNN1

Borosilicate Glas wafer 4 inch, thickness = 700 µm, 1-side polished

Stock: 86

From €13.20*

Details

Borosilicate Glas wafer 6 inch 700 um DSP

WGS60700200X0000SNN1

Borosilicate Glas wafer 6 inch, thickness = 700 µm, 2-side polished, TTV<10um, Bow/Warp<40um, 1 SEMI Flat, Ra<1 nm

Stock: 244

From €27.00*

Details

Borosilicate glass wafer 2 inch 500 um DSP

WGS2050025XX0000SNN1

Borosilicate glass 2 inch glass wafer, thickness = 500 ± 25 µm, 2-side polished, primary flat 16 mm

Stock: 729

From €5.20*

Details

Borosilicate glass wafer 2 inch 500 um DSP

WGS2050025XX0000SNN2

Borosilicate glass 2 inch glass wafer, thickness = 500 ± 25 µm, 2-side polished, no flat

Stock: 561

From €4.80*

Details

Borosilicate glass wafer 2 inch metallized Cr 10 nm, Au 100 nm

MWGCR002AU020CCZZZ01

Borosilicate glass 2 inch glass wafer, thickness = 500 ± 25 µm, 2-side polished, primary flat 16 mm, metallized one side with Cr: 10 nm and Au: 100 nm

Stock: 23

From €45.70*

Details

Borosilicate glass wafer 3 inch 500 um DSP

WGS3050025XX0000SNN1

Borosilicate glass 3 inch glass wafer, thickness = 500 ± 25 µm, 2-side polished, primary flat 22 mm

Stock: 348

From €10.50*

Details

Borosilicate glass wafer 4 inch 200 um DSP

WGS40200200X0000SNN2

Borosilicate glass wafer 4 inch, thickness = 200 µm, 2-side polished 1 SEMI Flat

Stock: 241

From €22.80*

Details

Borosilicate wafer 4 inch 1000 um DSP

WGS41000200X0000SNN1

Borosilicate 4 inch, thickness = 1000 ± 20 µm, 2-side polished, primary flat 32.5 mm

Stock: 490

From €15.20*

Details

CZ-Si wafer 1 inch 150 um (100) DSP B-doped

WSA10150250B8021XNN1

Prime CZ-Si wafer 1 inch, thickness = 150 ± 25 µm, (100), 2-side polished, p-type (Boron), 0.008 - 0.02 Ohm cm, no flat

Stock: 195

From €8.00*

Details

CZ-Si wafer 1 inch 200 um (100) DSP B-doped

WSA10200250B1314XNN1

Prime CZ-Si wafer 24.5 +/- 0.3 mm diameter, thickness = 200 ± 25 µm, (100), 2-side polished, p-type (Boron), TTV < 10 µm, 1 - 10 Ohm cm, !! no flat !!, units of 50 wafers stacked in cakeboxes

Stock: 297

From €4.80*