If you are interested in technical information or a free sample of our new products, please don't hestitate to contact us.

> sales(at)microchemicals.com
>
tech@microchemicals.com

NEWS

July 2021

NOW AVAILABLE

MEK from MicroChemicals

We are expanding our portfolio again. Our solvents acetone, isopropyl alcohol and DMSO are now joined by our MicroChemicals MEK in ULSI quality. This ultrapure substance is available in 2.5 L containers and can be ordered both as a single bottle and in the packaging unit of 4 x 2.5 L.

> Online-Shop MEK

> Infosheet
> Specification MEK

If you are interested in a sample of our MEK, please let us know.

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July 2021

New Products:

- AZ® 400K 1:4 MIC is based on buffered KOH and a ready to use dilution 1:4 (1 part of concentrate and 4 parts of DI-water) and can be usedespecially for our thicker resist types, such as AZ® 4562, AZ® 10XT and AZ® 40XT.

- AZ® 2033 MIF is a more powerful developer compared to AZ® 2026 MIF and a replacement for AZ® 826 MIF. It is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting, and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33.

Developer K45 is a highly concentrated solution of potassium carbonate designed for development of all aqueous dry film resists and photoimageable solder masks.

- AZ® P4K-AP is a thicker replacement for the AZ® 520D. The photoresist is a cost-effective coating for the protection of device surfaces during operations such as back-lap or backside etch. It is based on Novolak resin.

- AZ® LNR-003 is an option for all users who cannot work with the Japanese 5214E or who need an alternative for the AZ® nLOF 2000 and AZ® nLOF 5500 series. The resist is a negativ resist for film thicknesses of approx. 3 - 5 µm, diluted down to 1 µm, which allows an adjustable and strong undercut (negative resist profile) even at small resist film thicknesses for also ambitious lift-off applications.

- AZ® Remover 920 photoresist stripper is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films.

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July 2021

! Ordyl FP 700 phase out !

The manufacturer informed us that the dry film Ordyl FP 700 will be phased out. The alternative product is Ordyl FP 400. Find more information about it here.

We are very sorry about this decision from the manufacturer, and will do our best to allow you a smooth transfer to an alternative resist.

Technical help: tech@microchemicals.com

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February 2021

! AZ 520 D phase out !

The manufacturer Merck informed us that the protective coating AZ 520 D will be phased out no later than end of 2021 (official statement).
Basically, the AZ 520 D is a photoresist without photoactive compound, which should make it comparable easy to find a suited alternative. We would be glad if you contact us to discuss your requirements on a protective coating, and assist in finding another resist from our portfolio, which could either be a standard low-cost photoresist, or another PAC-free resist.

We are very sorry about this decision from the manufacturer, and will do our best to allow you a smooth transfer to an alternative resist.

Technical help: tech(at)microchemicals.com

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January 2021

! AZ 5214E phase out !

The manufacturer Merck informed us, that the photoresist AZ 5214E will be phased out until end of 2021 (official statemant). We also have been informed, that a similar (but not identical) product is already on the market: The Japanese version of the AZ 5214E.

In order to assist you for qualification of the Japanese AZ 5214E, we will be able to provide samples of this resist in near future (probably February/March 2021) as well as technical support in process parameter optimization.

Please feel free to contact us!

Sample request: sales(at)microchemicals.com
Technical help: tech(at)microchemicals.com

The following two documents detail the comparison studies of the "old" and Japanese AZ 5214E in both, positive and negative mode:

> AZ 5214E comparison studies negative
>
AZ 5214E comparison studies positive

> AZ 5214E Japan MSDS (EN)
> AZ 5214E Japan MSDS (DE)

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December 2020

! PRODUCTION STOP OF NMP !

For some years now, NMP has been classified as toxic to reproduction and the use of NMP has become more and more restricted. Now the EU has continued to restrict the use of NMP, so that after 09.05.2020, NMP can only be used if special precautions are taken.

Technic France, our current single supplier for NMP, has now decided to completely stop the production of the NMP.

We have many products in our portfolio that can replace NMP and many customers have already qualified alternatives in the past due to the increasingly problematic situation regarding NMP. DMSO, TechniStrip D350, NI555, P1316, P1331, MLO-07, Micro D2, AZ 100 Remover or the strippers from Intelligent-Fluids SH5 and SVD can be considered as alternative products.

We would be happy to supply you with samples of possible alternatives; it is best to briefly describe the process and the (substrate) materials involved so that we can explore the best alternatives together with you.

Sample request: sales(at)microchemicals.com
Technical help: tech(at)microchemicals.com

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October 2020

AZ Remover 920 - Organic Solvent based Remover

AZ® Remover 920 photoresist stripper is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films. Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code.

> AZ® Remover 920 (TDS)

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July 2020

! AZ MIR 701 product change !

The manufacturer of the resist AZ 701 MIR (14 and 29 cPs) informed us on a scheduled product change notification concerning a PFOA related ingredient (PCN).

As the qualification document (each one for both viscosities) shows, the PFOA-free AZ 701 MIR does not reveal significant changes compared to the PFOA-containing AZ 701 MIR.

If you would like to test or qualify the PFOA-free AZ 701 MIR, we will be able to provide samples.

Please feel free to contact us!

Sample request: sales(at)microchemicals.com
Technical help: tech(at)microchemicals.com

> AZ MIR 701 14CPS comparison studies
>
AZ MIR 701 29CPS comparison studies

> AZ MIR 701 14CPS PFOA-free MSDS (EN)
> AZ MIR 701 14CPS PFOA-frei MSDS (DE)
> AZ MIR 701 29CPS PFOA-free MSDS (EN)
> AZ MIR 701 29CPS PFOA-frei MSDS (DE)

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Juni 2020

DMSO from MicroChemicals

In addition to our solvents acetone and isopropyl alcohol, we are now offering our new MicroChemicals DMSO in ULSI quality. The solvent and stripper is available in 2.5 L containers and can be ordered as single bottles or in the packaging unit of 4 x 2.5 L.

Due to its low vapor pressure and its water solubility, DMSO is an excellent stripper for resists respectively Lift-off media and is a non-toxic substitute for the NMP, which has been classified as toxic since a while. The optional addition of cyclopentanone or MEK increases the performance of the stripper for certain
applications and significantly lowers the melting point of pure DMSO.

If you are interested in a sample of our DMSO, please let us know.

> Online-Shop DMSO

> DMSO Specificationen
> DMSO Infoblatt

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April 2020

OUR WAFER ONLINE SHOP

Visit our new Wafer Online Shop.
Here you will find all information about the different wafertypes, prices and availability.

Order easily online:
> Online Shop

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März 2019

! IMPORTANT NOTE REGARDING AZ 826 MIF DEVELOPER !

Recently we were informed by the manufacturer Merck, whose distributor we are, about changes of the product AZ 826 MIF Developer.
Futher information you can find in the documents below:

Step 1:

> AZ 800 MIF Developers PCN Letter
> AZ 800 MIF Developer techn. Daten

Step 2:

> AZ 826 MIF Developer PCN Letter
> AZ AZ 2026 MIF vs. AZ 826 MIF

> MSDS AZ 2026 MIF (german)
> MSDS AZ 2026 MIF (english)

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Mai 2019

Our new Strippers

Photoresist Stripper SVD and SH5

The strippers easily removes layers of photoresists (PR) from inorganic substrates such as silicon, glass and metals (e.g. copper). The smart intelligent fluids® (IF) mode of action is not based on aggressive dissolving processes as in the case of many conventional products. Instead, intelligent fluids® enable a gentle physical detaching even of persistent layers, without damaging the substrate surface.

More Information:

> Photoresist Stripper SVD
> Photoresist Stipper SH5

Technical Data Sheet:

> Photoresist Stripper SVD (TDS)
> Photoresist Stripper SH5 (TDS)

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Juni 2018

Acetone and Isopropyl Alcohol from MicroChemicals

We are now offering our new MicroChemicals Acetone and Isopropyl Alcohol in ULSI quality. Our solvents are available in 2.5 L containers and can be ordered as single bottles or in the packaging unit of 4 x 2.5 L. Both products are ideal for substrate cleaning for organic contaminants and particles.

> Online-Shop Acetone
> Online-Shop Isopropyl Alcohol

> Info sheet
> Specification Acetone
> Specification Isopropyl Alcohol

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Resists:

AZ® 12XT

AZ® 12XT is a chemically amplified thick positive resist characterized by its excellent environmental stability and suitability for plating and RIE etc applications. Even for very high resist film thickness, AZ® 12XT requires only short softbake times, no delay for rehydration, very small exposure doses due to its chemical amplification and reveals a high development rate.

AZ® 15nXT (115 and 450 CPS)

AZ® 15nXT is a negative resist for various plating & etching applications with an excellent adhesion. AZ® 15nXT comes in two viscosities to cover 2 - 10 µm film thickness, is compatible with Cu substrates and other metals as well as TMAH-based developers.

> AZ® 15nXT (115 CPS)
> AZ® 15nXT (450 CPS)

AZ® 5209 E

The AZ® 5209 E is the thinner version of the AZ® 5214 E. This image reversal resist is specially designed for high-resolution lift-off applications requiring negative resist profiles. It is characterized by an improved adhesion, high thermal stability and can be developed in standard NaOH- or TMAH-based developers.

> AZ® 5209 E

AZ® MIR 701 (14 and 29 cPs)

AZ® MIR 701 is a thermally stable (softening point > 130°C), high resolution photo resist optimized for dry etching of sub-µm structures, thus a suited alternative for the discontinued AZ® 6600 series. The AZ® MIR 701 is available in two viscosities to cover 0.7 - 4 µm film thickness, even lower film thickness can be realized via dilution.

> AZ® MIR 701

AZ® nLOF 5510

AZ® nLOF 5510 is a thin, high-resolution negative resist with high thermal stability. This resist is designed for single layer lift off processes as well as for RIE etching or ion implantation and compatible with TMAH-based developers.

AZ® P4110 and AZ® P4903

AZ® P4110 and AZ® P4903 are positive resists characterized by a lower photo active compound concentration which allows the application of thick and very thick resist films (approx. 3 - 30 µm). Their improved adhesion to all common substrate materials makes the AZ® P4110 and AZ® P4903 suited for e. g. wet etching or plating applications.

> AZ® P4110
> AZ® P4903

AZ® TFP 650 F5

AZ® TFP 650 F5 is a positive resist with very high photo speed and contrast, applicable in spin or extrusion coating.  AZ® TFP 650 F5 shows an excellent adhesion even under harsh etching conditions.

> AZ® TFP 650 F5

AZ® TX1311 1G

AZ® TX 1311 is a chemically amplified positive deep-UV (DUV) resist (248 nm wavelength) for very high aspect ratios at resist film thicknesses of several µm. It is optimized for high energy implant applications, and – due to its high thermal stability – also well suited for dry etching processes.

Developers:

AZ® 340 Developer

AZ® 340 is a sodium based developer concentrate to be diluted with DI water. Strong solutions are used for thick photoresists, more diluted solutions are used for thinner photoresists.

Strippers / Removers:

TechniClean™ CA25

A semi-aqueous proprietary blend that has been formulated to address post etch residue (PER) removal for all interconnect and technology nodes. This advanced chemistry offers a unique blend of ingredients that have been proven to be extremely efficient at quickly and selectively removing organo-metal oxides from the following materials: Al, Cu, Ti, TiN, W and Ni.

> TechniClean CA25

TechniStrip™ NF52

TechniStrip™ NF52 is a highly effective remover for negative resists (liquid resists as well as dry films). The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.

TechniStrip™ Micro D2

TechniStrip™ Micro D2 is a versatile stripper dedicated to address resin lift-off and dissolution on negative and positive tone resist. The organic mixture blend has the particularity to offer high metal and material compatibility allowing to be used on all stacks and particularly on fragile III/V substrates for instance.

> TechniStrip™ Micro D2

TechniStrip™ MLO 07

TechniStrip™ MLO 07 is a highly efficient positive and negative tone photoresist remover used for IR, III/V, MEMS, Photonic, TSV mask, solder bumping and hard disk stripping applications. It is developed to address high dissolution performance and high material compatibility on Cu, Al, Sn/Ag, Alumina and organic substrates.

> TechniStrip™ MLO 07

Plating:

AX100 (Plating Activation Solution)

AX100 is an acidic solution for the activation and pretreatment for electroplating on seed layers and metal surfaces, where direct metallization is often associated with adhesion problems. This applies e. g. in Au plating on nickel surfaces or the direct plating on Ti or TiW layers. AX100 activates metallic surfaces before electroplating and enables improved adhesion of electrodeposited coatings on metal surfaces which are prone to oxidation.

Etchants:

Cu Etch 200 UBM (Cu Etchant)

Cu-etch-200 UBM is a ready-to-use, slightly alkaline etchant for Cu and is used for the wet-chemical removal of Cu seed layers with selectivity to metals like Ni, Au, Cr, Sn, Ti. Common areas of use are for semiconductor fabrication or microsystem technology especially for the removal of seed layers after the plating of under-bump-metallization (UBM).

TechniEtch™ CN10 (Cu and Ni Etchant)

TechniEtch™CN10 is a Copper and Nickel Stripper based on a mixture of Nitric- and Phosphoric acid. The etching process should be carried out with an addition of 8-16 % Hydrogen peroxide (30 %) allowing a 25° C etching rate of approx. 0.3-0.4 µm per minute.

> TechniEtch™CN10

TechniEtch™ AC35 (Au and Cu Etchant)

TechniEtch™ AC35 is a iodine based gold/copper etchant which is characterized by  its enhanced stability and wetting and metal loading capability compared to conventional I­2/I3- based solutions.

The particularity of the TechniEtch™ AC35 is its capability to address combined Au/Cu etching step while controlling the gold layer undercut to a minimum when etching very fast thick Cu layer.

TechniEtch™ TBR19 (Ti, TiW and TiN Etchant)

TechniEtch™ TBR19 is a ready to use low undercut Ti etch chemistry for Cu bump pillars. The TechniEtch™ TBR19 is compatible with most under bump metallization (UBM) and copper pillar integration materials such as Cu, Al, Ni and alloys, glass, organic substrate and most plastics like polypropylene, HDPE, PFA, PTFE Kalrez, PEEK, PE. The etching rate at 50°C is around 1000 A/min.

TechniEtch™ SO102 (TEOS Etchant)

TechniEtch™ SO102 is a tetraethylorothosilicate (TEOS) etch solution which contains special additives for excellent wetting capability, dispersing and etch rate control.

TechniEtch™ TC

TechniEtch TC is a ready to use solution for etching of titanium, based on nitric- and hydrofluoric acid. The etch rate of titanium is around 0.2 - 0.4 µm/min at 25°C. Higher temperatures will increase the etch rate.

> TechniEtch TC


NOW AVAILABLE

Acetone and Isopropyl Alcohol from MicroChemicals

We are now offering our new MicroChemicals Acetone and Isopropyl Alcohol in ULSI quality. Our solvents are available in 2.5 L containers and can be ordered as single bottles or in the packaging unit of 4 x 2.5 L. Both products are ideal for substrate cleaning for organic contaminants and particles.

> Acetone
> Isopropyl Alcohol

> Info sheet
> Specification Acetone
> Specification Isopropyl Alcohol

If you are interested in further technical information or a free sample, please don't hestitate to contact us. > sales(at)microchemicals.com


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