AZ EBR Solvent - 5.00 l
Merck Performance Materials GmbH
AZ® EBR Solvent is the main solvent of almost all our photoresists and can be used for dilution and edge bead removal.
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Product number:
1000002
Manufacturer:
Merck Performance Materials GmbH
Product information "AZ EBR Solvent - 5.00 l"
AZ® EBR Solvent
1-methoxy-2-propyl-acetate
General Information
AZ® EBR Solvent is the main solvent/thinner of almost all AZ® and TI photoresists due to its low vapour pressure and its suppression of particle formation in the (further diluted) resist. Additionally, PGMEA is often used for edge bead removal, since its low vapour pressure prevents further thinning of the coated resist film.
Product Properties
- Density: 0.97 g/cm3
- Melting point: -66°C
- Boiling point: 125°C
- Flash point: 45°C
- Vapour pressure @ 20°C: 5 hPa
PGMEA Molecule
Further Information
MSDS:
Safety Data Sheet AZ® EBR Solvent english
Sicherheitsdatenblatt AZ® EBR Solvent german
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Purity:
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General Information
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Melting point: 95°C
Boiling point: 56°C
Flash point: < -18°C
Vapour pressure @ 20°C: 244 hPa
Acetone Molecule
Further Information
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Safety Data Sheet Acetone english (TECHNIC France)
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Application Notes:
Solvents english
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General Information
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Product Properties
Density: 0.88 g/cm3
Melting point: -77°C
Boiling point: 127°C
Flash point: 27°C
Vapour pressure @ 20°C: 10.7 hPa
Further Information
MSDS:
Safety Data Sheet Butyl Acetate (VLSI) english
Sicherheitsdatenblatt Butyl Acetate (VLSI) german
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Specs Butyl Acetate (VLSI)
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General Information
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Density: 0.88 g/cm3
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Cyclopentanone Molecule
Further Information
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Sicherheitsdatenblatt Cyclopentanon (ULSI) german
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NOTE:
The solvent DMSO (dimethyl sulfoxide) has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is.
For more details please download the info letter.
Product Properties
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Further Information
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General Information
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Isopropyl alcohol Molecule*
Further Information
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Application Notes:
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MEK Molecule
Further Information
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Methanol Molecule
Further Information
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Sicherheitsdatenblatt Methanol (VLSI) german
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Further Information
MSDS:
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Further Information
MSDS:
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Application Notes:
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General Information
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Spray coating formulations are often made from three components - the high-boiling Spray Thinner PGMEA, the low-boiling MEK Spray Thinner, and the corresponding resist. Depending on the mixing ratio and the wanted result, the proportions of the substances must be adjusted.
A high proportion of PGMEA (low vapour pressure) creates very smooth layers with moderate edge coverage, while a formulation with a high MEK content (high vapour pressure) creates very good edge coverage but comparatively rough layers.
The optimal compromise of the solvent mixture is often a mixing ratio MEK: PGMEA of 1:3 to 3:1. Depending on the viscosity, required by the spray coating tool used, this solvent mixture is added to the resist in a ratio of 1:3 to 1:10. So one part resist to 3 parts solvent mixture up to one part resist to 10 parts solvent mixture.
Further Information
MSDS:
Safety Data Sheet MC Spray Thinner PGMEA english
Sicherheitsdatenblatt MC Spray Thinner PGMEA german
Application Notes:
Solvents: Theory and Application english
Lösemittel: Theorie und Anwendung german
Further Information about Processing
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Bottle size:
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General Information
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NOTE:
The solvent TechniStrip® Micro D350 has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is.
For more details please download the info letter.
Further Information
MSDS:
Safety Data Sheet TechniStrip Micro D350 (ULSI) english
Sicherheitsdatenblatt TechniStrip Micro D350 (ULSI) german
TDS:
Technical Data Sheet TechniStrip Micro D350 (ULSI) english
Specs:
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Application Notes:
Photoresist Removal english
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Further Information about Processing
AZ EBR 70/30 - 5.00 l
1070302
Bottle size:
5.00 l
AZ® EBR Solvent 70/30
1-methoxy-2-propyl-acetate
General Information
AZ® EBR Solvent 70/30 is the main solvent/thinner of almost all AZ® and TI photoresists due to its low vapour pressure and its suppression of particle formation in the (further diluted) resist. Additionally, PGMEA is often used for edge bead removal, since its low vapour pressure prevents further thinning of the coated resist film.
Product Properties
Density: 0.97 g/cm3
Melting point: -66°C
Boiling point: 125°C
Flash point: 45°C
Vapour pressure @ 20°C: 5 hPa
PGMEA Molecule
Further Information
MSDS:
Safety Data Sheet AZ® EBR Solvent 70/30 english
Sicherheitsdatenblatt AZ® EBR Solvent 70/30 german
TDS:
Technical Data Sheet AZ® EBR Solvent 70/30 english
Information AZ® EBR Solvent 70/30 english