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Fused silica JGS2 wafer 35 x 35 mm 700 um DSP

Fused Silica wafer 700 µm

Beschreibung

Produktinformationen "Fused silica JGS2 wafer 35 x 35 mm 700 um DSP"

Fused silica JGS2 wafer piece (35 x 35 mm), thickness = 700 ± 25 µm, 2-side polished, units of 20 pieces in PE film packaging